National research center unveils substrate-less chip-level packaging technique

Taiwan's National Institutes of Applied Research (NIAR) has introduced an open R&D platform featuring a chip-level packaging technique that eliminates the use of substrates as part of its effort to bolster the country's advanced packaging ecosystem.

(Full text of the story is now in CNA English news archive. To view the full story, you will need to be a subscribed member of the CNA archive. To subscribe, please read here.)