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ITRI breaks ground on NT$3.77 billion advanced chip R&D base

02/10/2026 04:48 PM
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Premier Cho Jung-tai (eighth right) attends the groundbreaking ceremony of the Industrial Technology Research Institute's Advanced Semiconductor R&D Base, along with officials and industrial representatives in Hsinchu on Tuesday. CNA photo Feb. 10, 2026
Premier Cho Jung-tai (eighth right) attends the groundbreaking ceremony of the Industrial Technology Research Institute's Advanced Semiconductor R&D Base, along with officials and industrial representatives in Hsinchu on Tuesday. CNA photo Feb. 10, 2026

Taipei, Feb. 10 (CNA) The Hsinchu County-based Industrial Technology Research Institute (ITRI) on Tuesday broke ground on its Advanced Semiconductor R&D Base, a NT$3.772 billion (US$119.57 million) publicly funded project slated for completion in December 2027, with phased operations beginning in the first quarter of 2028.

Speaking at the groundbreaking ceremony, Premier Cho Jung-tai (卓榮泰) said Taiwan Semiconductor Manufacturing Co. (TSMC) has actively supported the establishment of the R&D base, including donating three 12-inch advanced-process semiconductor development tools and providing extensive assistance and guidance on plant design and construction.

Premier Cho Jung-tai (left) breaks ground for the Industrial Technology Research Institute's Advanced Semiconductor R&D Base in Hsinchu on Tuesday. CNA photo Feb. 10, 2026
Premier Cho Jung-tai (left) breaks ground for the Industrial Technology Research Institute's Advanced Semiconductor R&D Base in Hsinchu on Tuesday. CNA photo Feb. 10, 2026

In addition to Cho, the ceremony was attended by Minister of Economic Affairs Kung Ming-hsin (龔明鑫) and National Science and Technology Council Minister Wu Cheng-wen (吳誠文).

Representatives from major semiconductor firms, including TSMC, United Microelectronics Corp., Vanguard International Semiconductor Corp., Powerchip Semiconductor Manufacturing Corp., Nanya Technology Corp. and Advanced Semiconductor Engineering Inc., were also present, along with several equipment suppliers.

Once completed, the facility will carry out three key missions -- innovation trial production and verification for integrated circuit (IC) design, development of advanced semiconductor manufacturing processes, and localized verification of semiconductor equipment and materials--said Kuo Chao-chung (郭肇中), director-general of the Department of Industrial Technology under the Ministry of Economic Affairs.

Kuo said the new facility is expected to help semiconductor companies shorten product development timelines by around 30 percent, strengthening Taiwan's semiconductor innovation ecosystem and supply chain resilience.

According to Kuo, the project underwent two years of planning and will feature a building with an eight-meter ceiling height, a floor load capacity of two metric tons per square meter, and an independent seismic-resistant structure.

Construction of the building itself will cost NT$688 million, while cleanroom facilities will account for NT$3.084 billion, bringing total investment to NT$3.772 billion, Kuo said.

The base will house pilot production lines for advanced semiconductor processes, submicron sensing chips and advanced packaging, as well as laboratories for inspection, measurement and verification, he added.

(By Chang Chien-chung and Evelyn Kao)

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