TSMC R&D center scheduled to break ground in Q1 2020
Taipei, Dec. 6 (CNA) A new research and development center established by Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chipmaker, is scheduled to break ground in the first quarter of next year, aimed at facilitating the development of the sophisticated 3-nanometer process or even more advanced technology.
(Full text of the story is now in CNA English news archive. To view the full story, you will need to be a subscribed member of the CNA archive. To subscribe, please read here.)
Premier orders comprehensive inspection of IT protocols at schools09/26/2021 10:25 PM
New KMT chief Eric Chu reiterates 1992 consensus for ties with China09/26/2021 09:41 PM
Old Kaohsiung Station installed as part of rail redevelopment project09/26/2021 09:33 PM
Free flu shots for high-risk groups to be available Oct. 109/26/2021 07:21 PM
Ex-UK Conservative Party leader calls on free world to support Taiwan09/26/2021 07:14 PM