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TSMC no comment on reported plans for 4 new IC assembly plants

01/17/2026 05:46 PM
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CNA file photo
CNA file photo

Taipei, Jan. 17 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC) on Saturday remained tight-lipped over a media report the contract chipmaker plans to build an additional four advanced IC assembly plants in Taiwan.

The world's largest contract chipmaker declined to comment, saying any information on new facility construction will primarily come from public announcements.

A report published by the Liberty Times earlier Saturday indicated while TSMC is expanding its high-end chip production capacity, the chipmaker is also investing in the construction of advanced IC assembly plants.

Citing unnamed sources from TSMC's supply chain, the report said the chipmaker will build two IC assembly plants in the Chiayi Science Park and another two in the Southern Taiwan Science Park this year.

The report said Cliff Hou (侯永清), TSMC's senior vice president, deputy co-chief operating officer and chief information security officer, is scheduled to announce the new investment next week.

According to the report, TSMC is building two advanced IC assembly plants in Chiayi.

TSMC is investing in high-end chip production technologies in Hsinchu, Kaohsiung and the Southern Taiwan Science Park, while using Chiayi as a base for sophisticated IC assembly services.

In the fourth quarter of 2025, TSMC started mass production of the 2-nanometer process in Hsinchu and Kaohsiung.

At an investor conference held Thursday, TSMC Chairman and CEO C.C. Wei (魏哲家) said the company is planning to build several new 2nm process fabs in Hsinchu and Kaohsiung and will continue to invest more in advanced chip technologies and IC packaging services over the next few years.

TSMC has planned for capital expenditure of US$52.0 billion to US$56.0 billion in 2026, up 27-37 percent from 2025.

According to TSMC, 60-80 percent of the 2026 capex will go toward advanced process development, 10 percent to specialty processes, and 10-20 percent to high-end IC assembly, testing, photomasking, and other items.

(By Chiang Ming-yen and Frances Huang)

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