Powertech expects new plant to create over 3,000 new jobs
Taipei, Sept. 25 (CNA) Powertech Technology Inc., one of Taiwan's leading integrated circuit packaging and testing service providers, broke ground on a new plant in northern Taiwan on Tuesday that it expects will create more than 3,000 jobs.
Powertech is investing NT$50 billion (US$1.63 billion) in the new IC packaging and testing facility located in the Hsinchu Science Park, home to many of Taiwan's leading high-tech companies.
Construction of the new plant is scheduled to be completed in the first half of 2020, with equipment to be installed and production begun in the second half of the year, the company said.
Once operational, the new facility will increase Powerchip's workforce by about 3,000 people, it said. It currently has a workforce of 18,000 employees worldwide, with 15,000 of them in Taiwan.
The new plant, situated on an 8,000-ping (about 6.5 acre) plot of land, will have eight stories aboveground and two levels underground.
According to Powertech, the new plant will feature the advanced Fan-Out-Panel-Level Packaging (FOPLP) process seen as a cost-effective, next-generation, highly integrated IC packaging technology that cuts design time and operating costs.
The company said the FOPLP technology has been applied to chips used in a wide range of advanced applications such as 5G, artificial intelligence, biotech, self-driving, smart city development and the Internet of Things.
"The FOPLP technology will bring significant change to the global semiconductor industry," Powertech Chairman D.K. Tsai (蔡篤恭) said in a statement. "FOPLP technology will allow PTI to offer more services to our customers."
Powertech said the new plant will have a monthly capacity of 50,000 units, equivalent to 150,000 12-inch wafer chips.
At the groundbreaking ceremony Tuesday, Tsai said the new plant is expected to meet rising demand for the FOPLP technology.
The new investment also showed Powertech's ambitions to have sophisticated processes take root in Taiwan, he said.
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