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SEMICON Taiwan 2027 moved to August as exhibition demand grows

09/08/2026 11:39 AM
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From left: ASE Inc. CEO Tien Wu, TSMC Senior Vice President and Deputy Co-Chief Operating Officer Cliff Hou, MediaTek CEO Rick Tsai, Foxconn Chairman Young Liu and Unimicron Technology Corp. Chairman Shan-Chieh Chien. CNA photo Sept. 2, 2026
From left: ASE Inc. CEO Tien Wu, TSMC Senior Vice President and Deputy Co-Chief Operating Officer Cliff Hou, MediaTek CEO Rick Tsai, Foxconn Chairman Young Liu and Unimicron Technology Corp. Chairman Shan-Chieh Chien. CNA photo Sept. 2, 2026

Taipei, Sept. 8 (CNA) SEMICON Taiwan 2027 will be held Aug. 18-20, about three weeks earlier than its usual September slot, as organizers seek to secure sufficient space across multiple venues for the expanding trade show.

In a statement Monday, Semiconductor Equipment and Materials International (SEMI) said planning for the 2027 exhibition began a year in advance because of the growing demand for space for exhibits, forums and related events driven by artificial intelligence (AI).

Booth planning and advance selection began in June, with overall demand continuing to rise, including requests from European and American companies for additional exhibition space, the global semiconductor industry association said.

CNA photo Sept. 2, 2026
CNA photo Sept. 2, 2026

The announcement came after SEMICON Taiwan 2026 concluded on Sept. 4 at Taipei Nangang Exhibition Center.

The three-day exhibition attracted more than 130,000 industry professionals from 65 countries and featured over 1,300 exhibitors occupying 4,300 booths, both of which set records, according to SEMI.

More than 350 speakers took part in over 50 forums attended by a total of 11,000 people, while 120 presentations were held at the venue, the association said.

Discussions covered AI, advanced manufacturing processes and packaging, silicon photonics, quantum technology, sustainability, and cybersecurity, according to the statement.

The Smart Manufacturing Pavilion was the largest exhibition area, bringing together nearly 350 companies, up 20 percent from a year earlier, SEMI said.

An advanced packaging area featured nearly 300 companies, an annual increase of 6 percent, while new sections showcasing quantum technology, smart wafer fabrication and chiplets made their debut this year, according to the association.

SEMI said the growth of the smart manufacturing and advanced packaging areas reflected an industry-wide shift toward closer cooperation across chip design, materials and manufacturing as AI increases demand for speed, production scale and supply-chain resilience.

(By Chao Yen-hsiang)

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