TSMC to build 3 more advanced packaging fabs in Chiayi Science Park

Taipei, July 12 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC) will build three additional advanced packaging facilities in Phase II of the Chiayi Science Park (CSP), National Science and Technology Council (NSTC) head Wu Cheng-wen (吳誠文) said Sunday.

Speaking at the groundbreaking ceremony for the CSP Phase II, Wu said the roughly 90-hectare site will be developed into an advanced packaging industry cluster led by TSMC.

Two advanced packaging facilities at Phase I began mass production in June. Once both phases are fully operational, companies with facilities at the Chiayi Science Park are expected to generate more than NT$300 billion (US$9.35 billion) in annual output, he said.

According to Wu, the Phase II expansion is aimed at meeting growing global demand for high-performance computing (HPC) chips and advanced packaging technologies.

He said the Chiayi Science Park will connect with other Southern Taiwan Science Park branches in Tainan, Kaohsiung and Pingtung County as well as the Central Taiwan Science Park and Hsinchu Science Park to form the world's most comprehensive artificial intelligence and semiconductor industry corridor.