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Taiwan showcases scope of tech capabilities at chip forum in Europe

09/10/2026 01:29 PM
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Tsai Hung-yin, president of the National Institutes of Applied Research, poses for a photo during the Taiwan-Europe Chip Innovation Forum (TECIF) in Antwerp on Wednesday. CNA photo Sept. 10, 2026
Tsai Hung-yin, president of the National Institutes of Applied Research, poses for a photo during the Taiwan-Europe Chip Innovation Forum (TECIF) in Antwerp on Wednesday. CNA photo Sept. 10, 2026

Antwerp, Belgium, Sept. 10 (CNA) Taiwan highlighted its technological resilience and capabilities at a semiconductor forum in Belgium on Wednesday, with four national research centers participating in the event.

Taiwan's semiconductor strengths extend beyond manufacturing and design to equipment, instrumentation, and earthquake-resistant systems essential to chip production, one of the top delegates said at the opening of the third Taiwan-Europe Chip Innovation Forum (TECIF) in Antwerp on Wednesday.

With that in mind, one of Taiwan's goals is to expand its semiconductor engagement with Europe from largely one-way exchanges to broader cooperation across the technology ecosystem, said Tsai Hung-yin (蔡宏營), president of the National Institutes of Applied Research (NIAR).

The participation of four NIAR institutions in the two-day forum this year demonstrated the breadth and resilience of Taiwan's technological capabilities, Tsai said.

He was referring to the Taiwan Semiconductor Research Institute, National Center for High-performance Computing, National Center for Instrumentation Research, and National Center for Research on Earthquake Engineering.

The Taiwan-Europe Chip Innovation Forum (TECIF) in Antwerp. CNA photo Sept. 10, 2026
The Taiwan-Europe Chip Innovation Forum (TECIF) in Antwerp. CNA photo Sept. 10, 2026

Jointly organized by NIAR's Taiwan Semiconductor Research Institute and Belgium-based research organization imec, the forum features discussions on research findings, advanced technologies, talent development, and Taiwan-Europe cooperation.

Tsai said that Europe has a strong foundation in basic science and research, while Taiwan excels at rapid manufacturing and commercialization.

Combining those complementary strengths could eventually support a cross-border research and development platform that would benefit both the academic and industrial sectors, he said.

Tsai also highlighted the Taiwan-Europe Scholarship program, which has brought more than 500 European students to study semiconductor manufacturing in Taiwan.

More integrated programs, ranging from undergraduate to doctoral education, could help European students develop stronger cultural links with Taiwan and eventually gain employment in Taiwanese semiconductor companies operating in Europe, Tsai added.

Taiwan's representative to the European Union, Shieh Jhy-wey (謝志偉), said at the forum that despite the security threats against Taiwan and its diplomatic isolation, its internationally recognized semiconductor achievements have helped it to build close connections with the world.

Like nanotechnology, Taiwan may be small, but it has experienced rapid growth, Shieh said, adding that the country has both the ability and willingness to contribute internationally.

The two-day TECIF in Antwerp was attended by hundreds of representatives from the industrial and academic sectors in Taiwan and Europe.

(By Wu Po-wei and Chao Yen-hsiang)

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