Taiwan, U.K. sign MOU to boost semiconductor talent cooperation

Taipei, Sept. 12 (CNA) Taiwan and the United Kingdom inked a deal on Thursday that would pave the way for bilateral collaboration in talent development in the semiconductor sector, according to Taiwan's Ministry of Foreign Affairs (MOFA).

In a new release issued on Friday, MOFA said the Taiwan-U.K. Memorandum of Understanding on the Semiconductor Joint Skills Project was signed during a ceremony in Taipei.

Taiwan's Deputy Foreign Minister François Wu (吳志中) said during the ceremony that the MOU marked "a milestone" in bilateral semiconductor cooperation, particularly given the two sides' complementary strengths in the sector.

British National Technology Adviser Dave Smith, who led a delegation to the SEMICON trade show in Taipei this week, echoed that view, noting that Taiwan's advanced manufacturing capabilities and the U.K.'s strengths in innovation and research can complement each other, according to the release.

Smith said he looked forward to further collaboration between Taiwan and the U.K. in fields such as compound semiconductors, silicon photonics and quantum technologies.

The MOU was signed by Ruth Bradley-Jones, the U.K. representative to Taiwan, at the signing ceremony and Vincent Yao (姚金祥), Taiwan's representative to the U.K., via video link from London, according to MOFA.