TSMC supplier Gudeng launches operations at Arizona plant

Taipei, Oct. 7 (CNA) Taiwan-based wafer and packaging handling solutions provider Gudeng Precision Industrial Co. officially launched operations at its plant in Arizona on Tuesday, following the establishment of a production base in the U.S. state by contract chipmaker Taiwan Semiconductor Manufacturing Co. (TSMC).

Gudeng Chairman Chiu Ming-chien (邱銘乾), who presided over a ceremony to celebrate the official completion of new plant in Arizona said it marked a critical step in the company's global expansion amid the restructuring of global supply chains.

According to its website, Gudeng currently has production bases in Taiwan, China and South Korea.

The company also broke ground for a plant in the Kurume-Hirokawa New Industrial Park in Fukuoka Prefecture, Japan, on April 15, 2025.

Chiu said Arizona was selected as the location for Gudeng's overseas production base because the state, where TSMC operates an advanced wafer fab and plans to build additional facilities, including advanced chip packaging plants, has developed a comprehensive cluster covering the semiconductor and aerospace industries.

Chiu also praised Arizona for its large talent pool and the state government's long-term support for advanced manufacturing and technological innovation.

By taking advantage of its Arizona production site, Gudeng expects to provide better services to customers in the U.S. market and grow alongside its customers, Chiu said.

According to Gudeng, the company will leverage its Arizona location to establish an initial parts-processing production line.

In addition to TSMC and Gudeng, Taiwanese tech companies with investments in Arizona include semiconductor facility engineering services provider United Integrated Services Co. and electronics component maker Foxlink International Inc.