TSMC to build advanced IC packaging, testing plant in Japan: report
01/05/2021 07:12 PM
Taipei, Jan. 5 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chipmaker, is planning to set up a joint advanced integrated circuit packaging and testing plant in Japan at the invitation of the Japanese Ministry of Economy, Trade and Industry (METI), according to the United Daily News (UDN).
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