TSMC to build advanced IC packaging, testing plant in Japan: report
Taipei, Jan. 5 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chipmaker, is planning to set up a joint advanced integrated circuit packaging and testing plant in Japan at the invitation of the Japanese Ministry of Economy, Trade and Industry (METI), according to the United Daily News (UDN).
(Full text of the story is now in CNA English news archive. To view the full story, you will need to be a subscribed member of the CNA archive. To subscribe, please read here.)
Taiwan headline news08/02/2021 10:29 AM
U.S. dollar down in Taipei trading08/02/2021 10:17 AM
Taiwan shares open higher08/02/2021 09:10 AM
Team Taiwan at the Tokyo Olympics, Aug. 108/01/2021 10:37 PM
AIT to mark Fulbright Taiwan Day in November08/01/2021 10:08 PM