A newly unveiled plan by Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chip maker, to issue corporate bonds is aimed at raising funds for acquisitions to expand its non-core business to weather a cyclical slowdown in the global foundry industry, an analyst said Wednesday.
(Full text of the story is now in CNA English news archive. To view the full story, you will need to be a subscribed member of the CNA archive. To subscribe, please read here.)
Latest
- Politics
Taiwan doing all it can to prevent war amid China threat: VP Hsiao
10/28/2025 05:16 PM - Society
Taiwan reports new case of severe enterovirus in 4-day-old infant
10/28/2025 04:57 PM - Science & Tech
Taiwan should leverage semiconductors to make 'quantum leap': Expert
10/28/2025 04:35 PM - Politics
Taiwan envoy Lin Hsin-i departs for APEC South Korea 2025
10/28/2025 04:23 PM - Business
U.S. dollar closes lower on Taipei forex market
10/28/2025 04:18 PM