Foxconn, Intel partner on AI infrastructure, edge AI solutions

Taipei, June 4 (CNA) Taiwan's Foxconn, formally known as Hon Hai Precision Industry Co., announced Thursday a strategic partnership with Intel Corp. to jointly develop AI infrastructure, edge AI and physical AI solutions.

The collaboration will combine Intel's processors, silicon photonics technology and software ecosystem with Foxconn's strengths in global manufacturing, system integration and AI data center deployment, Foxconn said in a statement.

The two companies will explore end-to-end AI solutions spanning chips, racks, systems and applications, with the aim of accelerating the adoption of edge AI and physical AI technologies, Foxconn added.

In the AI rack segment, the partners plan to explore the development and commercialization of rack-scale AI infrastructure solutions, including Intel Xeon processor-based rack architectures and AI accelerators.

The collaboration will focus on key technologies such as high-speed interconnects, thermal management and liquid-cooling systems, system monitoring and AI data center scalability to improve both performance and energy efficiency, according to Foxconn.

The companies will also work together on next-generation edge AI and physical AI platform architectures, targeting applications including agentic AI, intelligent devices and robotics.

The partnership is expected to support a wide range of use cases, including smart manufacturing, smart cities, automotive applications and robotics, Foxconn added.

In addition, the two sides will explore cooperation in custom application-specific integrated circuits (ASICs), systems-on-chip (SoCs) and system integration design services, leveraging Intel's semiconductor technologies and Foxconn's manufacturing ecosystem to expand opportunities in global markets.

Foxconn Chairman Young Liu (劉揚偉) was cited in the statement as saying that the partnership will combine the two companies' strengths in computing platforms, system integration and global supply chains to help build next-generation AI infrastructure and accelerate the commercialization of AI applications.

Meanwhile, Intel CEO Lip-Bu Tan (陳立武) was quoted as saying that the rapid growth of AI, particularly large-scale inference and agentic AI workloads, is redefining the capabilities required for modern computing.

According to the statement, Tan said meeting those demands requires innovation across the technology stack, from next-generation silicon and chip design to rack-scale systems and the deployment of edge AI and physical AI applications.

He added that the partnership combines expertise in chip design, rack-scale solutions and global system integration, helping accelerate the development of end-to-end AI platforms and expand the global impact of AI.