Contract chipmaker Taiwan Semiconductor Manufacturing Co. (TSMC) is set to build two packaging plants using the sophisticated Chip on Wafer on Substrate (CoWoS) technology at the Chiayi Science Park in southern Taiwan, with construction of the first plant scheduled to begin in May and mass production in 2028.
(Full text of the story is now in CNA English news archive. To view the full story, you will need to be a subscribed member of the CNA archive. To subscribe, please read here.)
More in Q&A
- What is Core Pacific Case, how is TPP Chairman Ko involved?The high-profile detention of former Taipei mayor and incumbent Taiwan People's Party (TPP) Chairman Ko Wen-je (柯文哲) was extended for another two months on Friday, as prosecutors continue their investigation into alleged corruption known locally as the "Core Pacific City case."11/01/2024 07:32 PM
- Taiwan's free flu and COVID-19 vaccination programTaiwan kicked off its free influenza and COVID-19 vaccination program at hospitals and other medical facilities across the country on Tuesday.10/01/2024 03:58 PM
- How dangerous are hornet attacks in Taiwan?A 41-year-old man died after being attacked by hornets in Taitung County, southeastern Taiwan, last week. He had been guiding a group of students on a hike on Jinshuiying Old Trail when a swarm descended on him and stung him more than 50 times.08/28/2024 03:30 PM
Latest
- Politics
Ex-President Chen urges dialogue to ease Taiwan's political divisions
04/20/2025 08:37 PM - Society
Beyond the body: The battle for gender ID rights
04/20/2025 08:32 PM - Culture
Culture Ministry honors late influential Taiwanese painter
04/20/2025 08:30 PM - Culture
Indonesian diaspora celebrates Kartini Day in Taipei
04/20/2025 06:35 PM - Culture
Nymphia Wind crowns new RuPaul's Drag Race queen in glorious return
04/20/2025 05:04 PM