TSMC to mass produce chips on upgraded version of 3nm process in 2023

Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chipmaker, plans to roll out chips made on an upgraded version of its sophisticated 3 nanometer process in 2023.

(Full text of the story is now in CNA English news archive. To view the full story, you will need to be a subscribed member of the CNA archive. To subscribe, please read here.)