Taiwan, Lithuania sign pact on advanced packaging for next-gen chips

Taipei, Sept. 4 (CNA) Taiwan and Lithuania agreed on Friday to team up on cutting-edge semiconductor technologies, signing a memorandum of understanding (MOU) aimed at building advanced packaging machinery for the next generation of computer chips.

Speaking at the signing event in Taipei, Industrial Technology Research Institute (ITRI) President Chang Pei-zen (張培仁) said the MOU hopes to get private businesses to jointly develop advanced chip packaging equipment that combines Lithuania's laser expertise with Taiwan's digital imaging, precision scanning, and AI strengths.

Under the pact, the two governments will jointly contribute 5.6 million euros (US$6.5 million) over two years to promote private sector collaboration through international seminars, academic and industry exchanges, and technology matchmaking, according to the ITRI.

Chang signed the MOU on the final day of the three-day SEMICON Taiwan 2026 expo alongside representatives from two Taiwanese trade groups -- the Taiwan Electronic Equipment Industry Association and the Taiwan Electrical and Electronic Manufacturers' Association.

Signing the MOU for Lithuania were representatives of the Lithuanian Laser Association and the Center for Physical Sciences and Technology.

The agreement is the latest example of collaboration between Taiwan and Lithuania, which began expanding ties in 2021. The two sides have since signed various pacts covering semiconductors, biotechnology, space technology, and advanced manufacturing.