TSMC takes lead in 8 advanced technologies in last 2 years
Taipei, April 23 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chipmaker, said it has taken the lead over its peers in eight crucial technologies over the past two years.
TSMC said the eight firsts include the first for the chipmaker to complete the advanced 5 nanometer (nm) design infrastructure, the first to start commercial production of chips made on the 7nm Extreme Ultraviolet EUV process, the first to launch the 7nm automotive platform, and the first to begin mass production of chips made on the 7nm process.
In addition, TSMC also boasted other firsts, such as the first to secure the embedded magnetoresistive random-access memory (MRAM) qualification, the first to launch production in panel optical fingerprint sensor technology, the first to start 28nm radio frequency for 5G mmWave device production, and the first to launch production on the advanced fan-out package technology for high-performance computing (HPC) use.
TSMC's statement was released as the company celebrates the 25th anniversary of its North American Technology Symposium, the chipmaker's largest technology forum for customer collaboration.
The 2019 North American Technology Symposium will highlight TSMC's breakthroughs in advanced logic technology, the chipmaker said.
The symposium in Santa Clara will be followed by workshops in Boston May 1 and Austin May 8, TSMC said.
"By working with our customers, our advanced technologies have helped catalyze the smartphone revolution and have enabled the continuous advancement in wireless communication, while our latest 7nm process has become a key enabler of artificial intelligence (AI) already embedded into many innovative services," TSMC CEO C.C. Wei (魏哲家) said in the statement.
"Going forward, our 5nm and more advanced process technologies, combined with customer innovation, will bring amazing 5G experiences and transformative AI applications to our daily lives," Wei said.
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