Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chipmaker, on Monday announced plans to issue NT$13.9 billion (US$464.49 million) in unsecured corporate green bonds to fund green building construction and other eco-friendly projects.
(Full text of the story is now in CNA English news archive. To view the full story, you will need to be a subscribed member of the CNA archive. To subscribe, please read here.)
Latest
- Culture
Nymphia Wind makes history by triumphing on RuPaul's Drag Race
04/20/2024 03:18 PM - Sports
Taiwan's gymnast Lee Chih-kai 'burnt out' after hope for Paris dims
04/20/2024 03:05 PM - Cross-Strait
17 PLA aircraft cross Taiwan Strait median line or extension: Ministry
04/20/2024 12:57 PM - Business
Tech expert and witness to semiconductor boom, urges Taiwan to think big
04/20/2024 12:50 PM - Society
Taiwan to soon welcome its first indigenous dog as a police canine
04/20/2024 12:43 PM