Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chipmaker, will build a wafer fab using the super sophisticated 1 nanometer process in the Longtan section of Hsinchu Science Park, the head of the Hsinchu Science Park Bureau said on Monday.
(Full text of the story is now in CNA English news archive. To view the full story, you will need to be a subscribed member of the CNA archive. To subscribe, please read here.)
Latest
- Business
Sales of TWSE-listed firms up over 7%, led by tech sector
07/12/2025 01:29 PM - Business
Cut in aid to Taipower could lead to electricity rate hikes: Cabinet
07/12/2025 01:19 PM - Society
Stormy weather gives way to clearer skies in Taiwan: CWA
07/12/2025 12:05 PM - Sports
Taiwanese-Latvian duo advances to Wimbledon women's doubles final
07/12/2025 11:51 AM - Society
Taiwan headline news
07/12/2025 11:04 AM