Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chipmaker, will build a wafer fab using the super sophisticated 1 nanometer process in the Longtan section of Hsinchu Science Park, the head of the Hsinchu Science Park Bureau said on Monday.
(Full text of the story is now in CNA English news archive. To view the full story, you will need to be a subscribed member of the CNA archive. To subscribe, please read here.)
Latest
-
Society
Eight more clinics suspended for 6 months over alleged privacy violations
05/15/2026 06:14 PM -
Society
Employee dies after collapsing at Taipei horror-themed venue
05/15/2026 05:59 PM -
Business
U.S. dollar closes higher on Taipei forex market
05/15/2026 04:53 PM -
Society
Australian man rescued after 7 days stranded in Taitung cliff cave
05/15/2026 04:41 PM -
Politics
DPP, KMT spar over funding options for weapons excluded from budget bill
05/15/2026 03:41 PM