Hsinchu Science Park X breaks ground on first building

12/25/2021 05:35 PM
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The groundbreaking ceremony takes place in Hsinchu Saturday. CNa photo Dec. 25, 2021
The groundbreaking ceremony takes place in Hsinchu Saturday. CNa photo Dec. 25, 2021

Taipei, Dec. 25 (CNA) A groundbreaking ceremony was held for the first building in the Hsinchu Science Park X Saturday as the first step for the industrial park to create a new tech cluster in Taiwan.

Located close to the Hsinchu Science Park, which houses many of Taiwan's tech heavyweights such as contract chipmaker Taiwan Semiconductor Manufacturing Co. (TSMC), the Hsinchu Science Park X is expected to become the city's second tech corridor, with a focus on software development, the Hsinchu City Government said.

The first building is scheduled to be completed in March 2024, which is expected to create 2,800 jobs, the city government said.

The city government said the central government is planning to spend NT$18.3 billion on the Hsinchu Science Park X's development, and after the construction of the first building has begun, the second and third buildings will be in the pipeline.

Addressing the groundbreaking ceremony, President Tsai Ing-wen (蔡英文) said Taiwan had laid a good foundation for high-tech development, and the country will invest more in software innovation, with the Hsinchu Science Park X expected to be a critical part of these efforts.

The Hsinchu Science Park X, which is being jointly developed by the Ministry of Science Technology and the Hsinchu City Government, is expected to help Taiwan cement its "software power," in addition to its hardware strength, in a wide range of tech areas such as artificial intelligence, 5G, information communication technology, and big data, said Tsai.

President Tsai Ing-wen (center) speaks at the groundbreaking ceremony in Hsinchu Saturday. CNA photo Dec. 25, 2021
President Tsai Ing-wen (center) speaks at the groundbreaking ceremony in Hsinchu Saturday. CNA photo Dec. 25, 2021

The president said Taiwan had become a global powerhouse in semiconductor development, and that after the outbreak of COVID-19 worldwide, the country had played an even bigger role in the global supply chain.

As for Taiwan's hardware strength, Tsai said Taiwan had taken the top spot in the world's pure play wafer foundry market by capturing a market share of over 70 percent, while the country ranked as the second-largest supplier in integrated circuit design and packaging and testing services.

Taiwan is also among the top three in the global liquid-crystal display (LCD), light-emitting diode (LED), and solar panel industries, which was further evidence of the country's efforts in hardware development, said Tsai.

TSMC is the world's largest contract chipmaker, while ASE Technology Holding Co. is the top IC packaging and testing service provider worldwide.

The operation of Hsinchu Science Park X is expected to attract more investment and talent, paving the way for Taiwan's high-tech industry to integrate its software and hardware strengths, said Tsai.

Echoing Tsai, Minister of Science and Technology Wu Tsung-tsong (吳政忠), who also attended the groundbreaking ceremony, said the Hsinchu Science Park had started from scratch four decades ago to become the world's most important semiconductor base, and he believed that the Hsinchu Science Park X would be able to use its software focus to lend more support to the Hsinchu Science Park.

Also at the groundbreaking ceremony, Premier Su Tseng-chang (蘇貞昌) said that to maintain the country's high-tech industry's leading position, he was pushing for Hsinchu City and Hsinchu County to be merged, which he expected would concentrate the resources of the two areas.

The merger of the two areas is an urgent issue, which Taiwan cannot afford to remain hesitant about, said Su.

The ruling Democratic Progressive Party is pushing for the merger of Hsinchu City and Hsinchu County to become the seventh municipality in Taiwan, while the opposition is against this.

(By Lu Kang-chun and Frances Huang)

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