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U.S. chip maker signs deal with Taiwan universities, research body

2012/09/20 16:14:38

Taipei, Sept. 20 (CNA) U.S. chip manufacturer Applied Materials Inc. signed a memorandum of understanding (MOU) Thursday with four universities and a state-funded research institute in Taiwan with the aim of focusing on cooperation projects and providing hundreds of internship opportunities abroad.

The company signed the MOU with National Taiwan University, National Chiao Tung University, National Tsing Hua University, National Cheng Kung University and the Industrial Technology Research Institute (ITRI), Taiwan's top industrial research body.

The MOU covers exchange of personnel, information and equipment, co-hosted seminars, research cooperation projects, as well as internship programs.

Beginning next year, the company will provide hundreds of internship opportunities abroad for students from the four universities, according to Applied Materials.

Interns who excel will have the opportunity to be directly recruited after graduation to join a rotational training program where they will be transferred to different departments every three months during their first year on the job to fast track their career prospects, the company said.

Taiwanese universities and research institutes are pioneers in the global high-tech industry, which was the major reason Applied Materials signed the MOU, said Mike Splinter, the company's chairman and CEO.

The company will provide research funding and share lab and research resources available at Maydan Technology Center in Santa Clara, California, with the universities and ITRI, Splinter said.

NTU President Lee Si-chen said Applied Materials is one of the most upstream companies in the semiconductor supply chain and a leader in the manufacturing process.

The cooperation will help support co-op efforts between schools and industries, he added.

(By Stacey Wu and Ann Chen)
ENDITEM/npw